PUR Moisture Curing Reactive Hot Melt Adhesive
- Bonding Range: Used for bonding plastics such as PC, ABS, PVC, etc. with metals such as aluminum and stainless steel.
- Application: Material bonding in the 3C electronics industry.
Construction process: dispensing machine dispensing - assembly - cold pressing bonding - holding pressure - static curing.
Instructions and features:
1, Drain the nozzle air before use.
3, Do not exceed continuous heating time of 6H, do not repeat heating more than 2 times.
4, If the heating time is too long, the top of the heat conductive hose may be crusted, and the crust will continue to be used.